AP3700M advanced power n and p-channel enhancement electronics corp. mode power mosfet simple drive requirement n-ch bv dss 30v low gate charge r ds(on) 20m fast switching performance i d 7.8a rohs compliant & halogen-free p-ch bv dss -30v r ds(on) 45m description i d -5.5a absolute maximum ratings@ t j =25 o c(unless otherwise specified) symbol parameter rating units n-channel p-channel v ds drain-source voltage 30 -30 v v gs gate-source voltage + 20 + 20 v i d @t a =25 7.8 -5.5 a i d @t a =70 6.2 -4.4 a i dm pulsed drain current 1 20 -20 a p d @t a =25 total power dissipation w t stg storage temperature range -55 to 150 t j operating junction temperature range -55 to 150 symbol value unit rthj-a maximum thermal resistance, junction-ambient 3 62.5 /w data and specifications subject to change without notice drain current, v gs @ 10v 3 drain current, v gs @ 10v 3 201508281 parameter 1 thermal data halogen-free product 2 g2 d2 s2 g1 d1 s1 s1 g1 s2 g2 d1 d1 d2 d2 so-8 a p3700 series are from advanced power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. it provides the designer with an extreme efficient device for use in a wide range of power applications. the so-8 package is widely preferred for all commercial- industrial surface mount applications using infrared reflo w technique and suited for voltage conversion or switch applications. .
n-ch electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =250ua 30 - - v v gs =10v, i d =7a - - 20 m ? v gs =4.5v, i d =6a - - 32 m v gs(th) gate threshold voltage v ds =v gs , i d =250ua 1 - 2 v g fs forward transconductance v ds =5v, i d =7a - 24 - s i dss drain-source leakage current v ds =24v, v gs =0v - - 10 ua i gss gate-source leakage v gs =+ 20v, v ds =0v - - + 100 na q g total gate charge i d =6a - 5 8 nc q gs gate-source charge v ds =15v - 1 - nc q gd gate-drain ("miller") charge v gs =4.5v - 2.4 - nc t d(on) turn-on delay time v ds =15v - 6 - ns t r rise time i d =1a - 8 - ns t d(off) turn-off delay time r g =6 -17- ns t f fall time v gs =10v - 4 - ns c iss input capacitance v gs =0v - 525 840 pf c oss output capacitance v ds =15v - 95 - pf c rss reverse transfer capacitance f=1.0mhz - 65 - pf r g gate resistance f=1.0mhz - 2.4 4.8 source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =1.5a, v gs =0v - - 1.2 v t rr reverse recovery time i s =7a, v gs =0v - 10 - ns q rr reverse recovery charge di/dt=100a/s - 3 - nc 2 AP3700M r ds(on) static drain-source on-resistance 2 .
AP3700M p-ch electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =-250ua -30 - - v v gs =-10v, i d =-5a - - 45 m ? v gs =-4.5v, i d =-4a - - 85 m ? v gs(th) gate threshold voltage v ds =v gs , i d =-250ua -1 - -2 v g fs forward transconductance v ds =-5v, i d =-5a - 8 - s i dss drain-source leakage current v ds =-24v, v gs =0v - - -10 ua i gss gate-source leakage v gs =+ 20v, v ds =0v - - + 100 na q g total gate charge i d =-4a - 5.2 8.3 nc q gs gate-source charge v ds =-15v - 1.4 - nc q gd gate-drain ("miller") charge v gs =-4.5v - 2.5 - nc t d(on) turn-on delay time v ds =-15v - 10 - ns t r rise time i d =-1a - 7 - ns t d(off) turn-off delay time r g =6 -25- ns t f fall time v gs =-10v - 10 - ns c iss input capacitance v gs =0v - 610 980 pf c oss output capacitance v ds =-15v - 100 - pf c rss reverse transfer capacitance f=1.0mhz - 75 - pf r g gate resistance f=1.0mhz - 11 22 source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =-1.5a, v gs =0v - - -1.2 v t rr reverse recovery time i s =-5a, v gs =0v - 12 - ns q rr reverse recovery charge di/dt=-100a/s - 4 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse test 3.surface mounted on 1 in 2 copper pad of fr4 board, t < 10sec ; 135 /w when mounted on min. copper pad. this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. 3 r ds(on) static drain-source on-resistance 2 .
AP3700M n-channel fig 1. typical output characteristics fig 2. typical output characteristics 30 -30 fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fig 5. forward characteristic of fig 6. gate threshold voltage v.s. reverse diode junction temperature 4 0 10 20 30 01234 v ds , drain-to-source voltage (v) i d , drain current (a) t a =25 10v 7.0v 6.0v 5.0v v g = 4.0v 0 10 20 30 01234 v ds , drain-to-source voltage (v) i d , drain current (a) t a =150 10v 7.0v 6.0v 5.0v v g =4.0v 14 16 18 20 22 246810 v gs , gate-to-source voltage (v) r ds(on0 (m ) i d = 6a t a = 25 o c 0.2 0.6 1.0 1.4 1.8 2.2 2.6 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =7a v g =10v 0 2 4 6 8 0 0.2 0.4 0.6 0.8 1 1.2 1.4 v sd , source-to-drain voltage (v) i s (a) t j =25 o c t j =150 o c 0.0 0.4 0.8 1.2 1.6 2.0 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized v gs(th) i d =250ua .
AP3700M n-channel fig 7. gate charge characteristics fig 8. typical capacitance characteristics 30 -30 fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. switching time waveform fig 12. gate charge waveform 5 q v g 4.5v q gs q gd q g charge 0 2 4 6 8 02468 q g , total gate charge (nc) v gs , gate to source voltage (v) i d =6a v ds =15v 0 200 400 600 800 1 5 9 13 17 21 25 29 33 37 v ds , drain-to-source voltage (v) c (pf) f =1.0mhz c iss c oss c rss 0.001 0.01 0.1 1 10 100 0.01 0.1 1 10 100 v ds , drain-to-source voltage (v) i d (a) t a =25 o c single pulse 100us 1ms 10ms 100ms 1s dc 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , pulse width (s) normalized thermal response (r thja ) p dm duty factor = t/t peak t j = p dm x r thja + t a r thja =135 o c/w t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse t d(on) t r t d(off) t f v ds v gs 10% 90% operation in this area limited by r ds(on) .
AP3700M n-channel fig 13. drain current v.s. ambient fig 14. total power dissipation temperature fig 15. typ. drain-source on state fig 16. transfer characteristics resistance 6 0 0.4 0.8 1.2 1.6 2 2.4 0 50 100 150 t a , ambient temperature( o c) p d , power dissipation(w) 0 20 40 60 80 0 4 8 12 16 20 24 i d , drain current (a) r ds(on) (m ) t j =25 o c 4.5v v gs = 10v 0 2 4 6 8 10 25 50 75 100 125 150 t a , ambient temperature ( o c ) i d , drain current (a) 0 10 20 30 012345 v gs , gate-to-source voltage (v) i d , drain current (a) t j =150 o c t j =25 o c v ds =5v t j = -55 o c .
AP3700M p-channel fig 1. typical output characteristics fig 2. typical output characteristics 30 -30 fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fig 5. forward characteristic of fig 6. gate threshold voltage v.s. reverse diode junction temperature 7 0 10 20 30 0246810 -v ds , drain-to-source voltage (v) -i d , drain current (a) t a =25 o c -10v -7.0v -6.0v -5.0v v g = - 4.0v 0 4 8 12 16 20 0246810 -v ds , drain-to-source voltage (v) -i d , drain current (a) t a = 150 o c -10v -8.0v -7.0v -6.0v -5.0v v g = - 4.0v 30 40 50 60 70 80 246810 -v gs , gate-to-source voltage (v) r ds(on) (m ) i d = -4 a t a =25 o c 0.2 0.6 1.0 1.4 1.8 2.2 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d = -5 a v g = - 10v 0 2 4 6 8 0 0.2 0.4 0.6 0.8 1 1.2 1.4 -v sd , source-to-drain voltage (v) -i s (a) t j =25 o c t j =150 o c 0.0 0.4 0.8 1.2 1.6 2.0 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized v gs(th) i d = - 250ua .
AP3700M p-channel fig 7. gate charge characteristics fig 8. typical capacitance characteristics 30 -30 fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. switching time waveform fig 12. gate charge waveform 8 q v g -4.5v q gs q gd q g charge 0 2 4 6 8 0246810 q g , total gate charge (nc) -v gs , gate to source voltage (v) i d = -4a v ds = -15v 0 200 400 600 800 1000 1 5 9 13172125293337 -v ds , drain-to-source voltage (v) c (pf) f =1.0mhz c iss c oss c rss 0.01 0.1 1 10 100 0.01 0.1 1 10 100 -v ds , drain-to-source voltage (v) -i d (a) t a =25 o c single pulse 100us 1ms 10ms 100ms 1s dc 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , pulse width (s) normalized thermal response (r thja ) p dm duty factor = t/t peak t j = p dm x r thja + t a r thja =135 o c/w t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse t d(on) t r t d(off) t f v ds v gs 10% 90% operation in this area limited by r ds(on) .
AP3700M p-channel fig 13. drain current v.s. ambient fig 14. total power dissipation temperature fig 15. typ. drain-source on state fig 16. transfer characteristics resistance 9 0 0.4 0.8 1.2 1.6 2 2.4 0 50 100 150 t a , ambient temperature( o c) p d , power dissipation(w) 0 40 80 120 160 200 024681012 -i d , drain current (a) r ds(on) (m ) t j =25 o c -4.5v v gs = -10v 0 2 4 6 8 25 50 75 100 125 150 t a , ambient temperature ( o c ) -i d , drain current (a) 0 4 8 12 16 20 0123456 -v gs , gate-to-source voltage (v) -i d , drain current (a) t j =150 o c t j =25 o c v ds = -5v t j = -55 o c .
AP3700M marking information 10 3700 ywwsss part numbe r date code (ywwsss) y last digit of the year ww week sss sequence .
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